Products

Two-part, thermally conductive epoxy encapsulant

One-part, void-free, second level epoxy underfill

One-part underfill compatible with small gap sizes

VOC- and solvent-free, UL 746E-rated conformal coating

General purpose, wicking-grade adhesive for disposable medical devices

Instant component bonding - high viscosity, medical grade, flexible adhesive

Low viscosity, high-performance liquid adhesive for silicone bonding

Instant component bonding - flexible components with fluorescence detection

Medium-viscosity adhesive for plastic bonding

Low-viscosity light cure adhesive for general and medical-device rigid bonding

Low-viscosity light-cure adhesive for general purpose and medical devices

Low-viscosity light-cure adhesive for close-fitting parts.